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? ? www.p-tec.net 062714 rev0 ms page 1 of 13 product specification part number PLBT3528-YDCW1 details ? single color surface mount led ? plcc-2 3.5 x 2.8 x 1.9mm ? package: 2,000pcs/reel ? emitting color: cool white ? ingan dice used features ? resin (mold) material: silicone ? rohs compliant ? 120 viewing angle ? low power consumption mechanical dimensions notes: 1. dimensions in millimeters and tolerance is 0.1mm unless otherwise noted. 2. specifications are subject to change without notice
? ? www.p-tec.net 062714 rev0 ms page 2 of 13 device selection guide model number chip lens type PLBT3528-YDCW1 material emitting color yellow diffused ingan cool white absolute maximum ratings at ta=25 parameter symbol rating unit power dissipation per dice pd 120 mw dc forward current per dice if 30 ma single chip pulsed forward current ifp 100 ma reverse voltage vr 5 v operating temperature topr -30~+80* storage temperature tstg -40~+100 soldering temperature tsol 260for5sec duty 1/10, pulse width 0.1ms soldering time max 10 seconds *please refer to if-ta diagram of curves for the temperature during application electrical and optical ch aracteristics at ta=25 note: 1. luminous intensity 10%, forward vo ltage (vf) 0.1v, wavelength(x,y) 0.01 ? 2. is standard testing recommended pad layout parameter symbol min. typ. max. unit condition forward voltage vf 2.9 3.0 3.4 v if=10ma luminous intensity iv 250 500 -- mcd wavelength x -- 0.2756 -- -- y -- 0.2703 -- -- reverse current ir -- -- 10 a vr=5v viewing angle 2 1/2 -- 120 \\ deg f=10ma
? ? www.p-tec.net 062714 rev0 ms page 3 of 13 typical electrical / optical characteristic curves
? ? www.p-tec.net 062714 rev0 ms page 4 of 13 range of bins bin bin1-a bin1-b bin1-c bin1-d bin1-e bin2 bin3 lv(mcd) 3-6 6-9 9-13 13-20 20-30 30-40 40-55 bin bin4 bin5 bin6 bin7 bin8 bin9 bin10 iv(mcd) 55-70 70-90 90-120 120-160 160-210 210-270 270-350 bin bin11 bin12 bin13 bin14 bin15 bin16 bin17 iv(mcd) 350-460 460-600 600-780 780-1000 1000-1300 1300-1700 1700-2200 bin bin18 bin19 bin20 bin21 bin22 bin23 bin24 iv(mcd) 2200-2800 2800-3600 3600-4600 4600-6000 6000-7800 7800-10100 10100-13130 bin bin25 bin26 iv(mcd) 13130-17000 17000-22100 bin wl(nm) hx2/3
? ? www.p-tec.net 062714 rev0 ms page 5 of 13 color coordinate comparison
? ? www.p-tec.net 062714 rev0 ms page 6 of 13 ir reflow temperature / time notes: 1. we recommend reflow temp of 245 (+/- 5 ) maximum soldering temp should be limited to 260 2. do not cause stress to the silicon resin while it is exposed to high temperatures 3. number of reflow process shall be 1 time
? ? www.p-tec.net 062714 rev0 ms page 7 of 13 test circuit and handling precautions 1. test circuit 2. over-current-proof a. customer must apply resistors for protection, otherwise slight voltage shift will cause big current change (burn out will happen) 3. storage a. it is recommended to store the products in the following conditions i. humidity: 60% r.h. max. | temperature : 5 ~30 (41 ~86 ) ii. shelf life in sealed bag: 12 month at 5 ~30 and 30% r.h. after the package is opened, the products should be used within a week or they should be stored at Q 20 r.h. with zip-lock sealed. 4. baking a. it is recommended to bake before soldering when the pack is unsealed after 24hrs. the conditions are as follows: i. 3.1 703 x(12~24hrs) and 5%rh, taped reel type ii. 3.2 1003 x(45min~1hr), bulk type iii. 3.3 1303 x(15~30min), bulk type
? ? www.p-tec.net 062714 rev0 ms page 8 of 13 test items and results of reliability
? ? www.p-tec.net 062714 rev0 ms page 9 of 13 reel and tape specifications feed direction dimensions of reel dimensions of tape arrangement of tape notes: 1. empty component pockets are sealed with top cover tape 2. the maximum number of missing smds is two 3. the cathode is oriented towards the tap sprocket hol e in accordance with ansi/eia rs-481 specifications 4. 2,000pcs/reel
? ? www.p-tec.net 062714 rev0 ms page 10 of 13 packaging specifications
? ? www.p-tec.net 062714 rev0 ms page 11 of 13 soldering 1. soldering according to the following temperature chart is recommended 2. soldering paste a. use soldering paste with the melting point at 230 collet 1. abnormal situation caused by improper setting of collet. a. choosing the right collet is the key issue in improving the product?s quality. leds are different from other electronic components, not only in terms of electrical output but also in terms of optical output. this characteristic makes leds more fragile in the process of smt. if the collet?s lowering down height is not well set, it will damage the gold wire at the time of collet?s picking up and loading, causing the led fail to light up. 2. how to choose the collet a. during smt, please choose the collet that has larger outer diameter than the lighting area of lens, in case improper position of collet damages the gold wire inside the led. different collets fit for different products. please refer to the following pictures
? ? www.p-tec.net 062714 rev0 ms page 12 of 13 3. how to set the height of collet additional notes a. no pressure should be exerted onto the epox y shell of the smd under high temperature b. do not scratch of wipe the lens. c. led should be used as soon as possible when being ta ken out of the original package, and should be stored in anti-moisture and anti-esd packaging
? ? www.p-tec.net 062714 rev0 ms page 13 of 13 record of revisions rev. comments page date 0 released spec -- 06/27/14 PLBT3528-YDCW1 customer approval signatures approved by checked by prepared by

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